TY - JOUR N2 - The paper describes a research on assessing the quality of edges resulting from the interaction of laser pulses with a material of rigid and flexible printed circuits. A modern Nd:YVO4 crystal diode-pumped solid-state laser generating a 532 nm wavelength radiation with a nanosecond pulse time was used for the research. Influence of laser parameters such as beam power and pulse repetition frequency on a heat affected zone and carbonization was investigated. Quality and morphology of laser-cut substrates were analyzed by optical microscopy. High quality laser cutting of printed circuit board substrates was obtained without delamination and surface damage, with a minimal carbonization and heat affected zone. The developed process was implemented on the printed circuit assembly line. L1 - http://czasopisma.pan.pl/Content/118245/PDF-MASTER/OPELRE_28_2020_P_Ciszewski.pdf L2 - http://czasopisma.pan.pl/Content/118245 PY - 2020 IS - 4 EP - 202 DO - 10.24425/opelre.2020.135258 KW - laser cutting KW - flexible printed circuits KW - heat affected zone (HAZ) A1 - Ciszewski, P. A1 - Sochacki, M. PB - Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of Technology VL - 28 DA - 17.11.2020 T1 - Processing of printed circuit boards using a 532 nm green laser SP - 197 UR - http://czasopisma.pan.pl/dlibra/publication/edition/118245 T2 - Opto-Electronics Review ER -