The heat transfer measurements were conducted during pool boiling of water on surfaces with microchannels. Parallel grooves were made on a copper surface with widths ranging from 0.2 mm to 0.5 mm at intervals of 0.1 mm. The inclination angle of the grooves to the horizontal was set at 30° and 60°, and the depth of the microchannel grooves was 0.3 mm. The achieved heat flux ranged from 25 kW/m>² to 1730 kW/m², and the heat transfer coefficients ranged from 12 kW/(m²K) to 475 kW/(m²K). The influence of geometric parameters such as width, inclination angle of the microchannel, surface ex-tension, and Bond number on heat exchange efficiency was examined. A nearly sixfold increase in α (heat transfer coeffi-cient) and a twofold increase in critical heat flux were observed compared to a smooth surface.

Technology advancements entail a necessity to remove huge amounts of heat produced by today’s electronic devices based on highly integrated circuits, major generators of heat. Heat transfer to boiling liquid flowing through narrow minichannels is a modern solution to the problem of heat transfer enhancement. The study was conducted for FC-72 boiling in a rectangular, vertical and asymmetrically heated minichannel that had depths of 0.5-1.5 mm, a width of 20 mm and a length of 360 mm. The heat flux increased and decreased within the range of 58.3-132.0 kWm−2, the absolute pressure ranged from 0.116 to 0.184 MPa and the mass flux was 185-1139.2 kgm−2s−1. The boiling process took place on a flat vertical heating surface made of Haynes-230 0.1 mm thick acid-proof rolled plate with the surface roughness of 121 μm.