Title

Implementation of mathematical model of thermal behavior of electronic components for lifetime estimation based on multi-level simulation

Journal title

Archives of Electrical Engineering

Yearbook

2017

Volume

vol. 66

Issue

No 2 June

Authors

Frivaldsky, Michal ; Pridala, Michal ; Drgona, Peter

Divisions of PAS

Nauki Techniczne

Publisher

Polish Academy of Sciences

Date

2017

Identifier

DOI: 10.1515/aee-2017-0025 ; ISSN: 1427-4221 ; eISSN: 2300-2506

Source

Archives of Electrical Engineering; 2017; vol. 66; No 2 June

References

Mirsky (2008), Determining end of life and lifetime calculations for electrolytic capacitors at higher temperatures, EDN. ; Varde (2010), Physics - of - Failure Based Approach for Predicting Life and Reliability of Electronics Components Newsletter vol, null, 1. ; Nicolics (2007), Thermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black - Resistors th International Spring Seminar on Technology, Polymer Electronics Romania, 30, 46. ; Hruska (2012), and FEM analyses of an electrically excited automotive synchronous motor of and Motion Control Conference Sad, Design Proceedings Power Electronics, 2. ; Gasperi (1997), Method for Predicting the Expected Life of Bus Capacitors Industry Application Meeting New Orleans, IEEE Society Annual USA. ; Albertsen (2010), capacitor lifetime estimation Europe GmbH, null. ; Frivaldsky (2014), Simple and accurate thermal simulation model of supercapacitor suitable for development of module solutions of thermal, International journal sciences, 34. ; Bâzu (2011), Lifetime prediction for components with scarce data : The worst case approach th International Symposium for Design and Technology in Electronic, IEEE Packaging Romania, 17, 309. ; Park (2013), Cost - effective power system with an electronic double layer capacitor for reducing the standby power consumption of consumer electronic devices of power, Journal Electronics, 11, 13.