Details

Title

Implementation of mathematical model of thermal behavior of electronic components for lifetime estimation based on multi-level simulation

Journal title

Archives of Electrical Engineering

Yearbook

2017

Volume

vol. 66

Issue

No 2 June

Authors

Divisions of PAS

Nauki Techniczne

Publisher

Polish Academy of Sciences

Date

2017

Identifier

DOI: 10.1515/aee-2017-0025 ; ISSN: 1427-4221 ; eISSN: 2300-2506

Source

Archives of Electrical Engineering; 2017; vol. 66; No 2 June

References

Mirsky (2008), Determining end of life and lifetime calculations for electrolytic capacitors at higher temperatures, EDN. ; Varde (2010), Physics - of - Failure Based Approach for Predicting Life and Reliability of Electronics Components Newsletter vol, null, 1. ; Nicolics (2007), Thermal Analysis of Multilayer Printed Circuit Boards with Embedded Carbon Black - Resistors th International Spring Seminar on Technology, Polymer Electronics Romania, 30, 46. ; Hruska (2012), and FEM analyses of an electrically excited automotive synchronous motor of and Motion Control Conference Sad, Design Proceedings Power Electronics, 2. ; Gasperi (1997), Method for Predicting the Expected Life of Bus Capacitors Industry Application Meeting New Orleans, IEEE Society Annual USA. ; Albertsen (2010), capacitor lifetime estimation Europe GmbH, null. ; Frivaldsky (2014), Simple and accurate thermal simulation model of supercapacitor suitable for development of module solutions of thermal, International journal sciences, 34. ; Bâzu (2011), Lifetime prediction for components with scarce data : The worst case approach th International Symposium for Design and Technology in Electronic, IEEE Packaging Romania, 17, 309. ; Park (2013), Cost - effective power system with an electronic double layer capacitor for reducing the standby power consumption of consumer electronic devices of power, Journal Electronics, 11, 13.

Open Access Policy

Archives of Electrical Engineering is an open access journal with all content available with no charge in full text version.


The journal content is available under the licencse CC BY-NC-ND 4.0. https://creativecommons.org/licenses/by-nc-nd/4.0/
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