Details Details PDF BIBTEX RIS Title The Influence of Mg Additive on the Structure and Electrical Conductivity of Pure Copper Castings Journal title Archives of Foundry Engineering Yearbook 2017 Volume vol. 17 Issue No 4 Authors Kranc, M. ; Garbacz-Klempka, A. ; Górny, M. ; Sikora, G. Keywords Solidification Process ; Primary grains ; Pure copper ; Castings ; Mg additive ; Electrical conductivity Divisions of PAS Nauki Techniczne Publisher The Katowice Branch of the Polish Academy of Sciences Date 2017 Type Artykuły / Articles Identifier DOI: 10.1515/afe-2017-0135 ; eISSN 2299-2944 Source Archives of Foundry Engineering; 2017; vol. 17; No 4 References Schlesinger (2011), Chapter Melting Casting In th ed, Metall, 20, 397. ; Vincent (2012), Effect of porosity on the thermal conductivity of copper processed by powder metallurgy, Phys Chem Solids, 73. ; Li (2011), The Effect of Pore Structure on the Electrical Conductivity of Ti Porous Media, null, 16, 87. ; Górny (2011), Copper and copper alloys with high conductivity, null. ; (2001), Speciality Handbook Copper copper alloys, International, 1. ; Chen (2011), Dependence of texture evolution on initial orientation in drawn single crystal copper, Mater Charact, 23, 237. ; Bydałek (2000), The rational principle of the copper alloys refining Solidif Met Alloy, null, 28, 65. ; Fu (2011), Study of ultrahigh - purity copper billets refined by vacuum melting and directional solidification Rare Met, null, 12, 304. ; Gu (null), Grain size dependent texture evolution in severely rolled pure copper, Mater Charact, 18, 2015. ; Zhang (2008), Microstructural characteristics of largescale ultrafine - grained copper, Mater Charact, 22, 59. ; Miyajima (null), Dislocation density of pure copper processed by accumulative roll bonding and equalchannel angular pressing, Mater Charact, 19, 2015. ; Habibi (2011), grained pure copper with high - strength and highconductivity produced by equal channel angular rolling process, Nano Mater Process Technol, 211. ; Yamamura (2001), Evaluation of porosity in porous copper fabricated by unidirectional solidification under pressurized hydrogen, Mater Sci Eng, 13, 318. ; Kuhn (2012), Properties of High Performance Alloys for Electromechanical Connectors in Alloy Early Perform Enhancing, Appl Curr Process InTech, 26, 51. ; (2010), Pure copper processed by extrusion preceded equal channel angular pressing, Mater Charact, 20, 61. ; Rzadkosz (2009), Influence of refining operations on a structure and properties of copper and its selected alloys, Arch Metall Mater, 30, 299. ; Ẑitňanský (1995), Refining of the Copper and investment casting, Mater Process Technol, 11, 53. ; Bonderek (2000), The phenomena of porosity in castings made of aluminium and magnesium Met Alloy, alloys, 51. ; Konečná (2012), Copper Copper Alloys Casting Classification Characteristic Microstructures in Alloy Early Perform Enhancing, Appl Curr Process InTech, 27, 3. ; Elsayed (2013), Sin Inclusions in magnesium and its alloys a, review Int Mater Rev, 14, 419. ; Shahzeydi (2016), The distribution and mechanism of pore formation in copper foams fabricated by Lost Carbonate method, Sintering Mater Charact, 15, 111. ; Benchabane (2008), Recrystallization of pure copper investigated by calorimetry and microhardness, Mater Charact, 21, 59. ; Hsu (1977), Impurity effects in highconductivity copper, JOM, 29, 21. ; Han (2014), Grain growth in ultrafine grain sized copper during cyclic deformation Alloys, null, 24, 615. ; Cuevas (2009), Electrical conductivity and porosity relationship in metal foams Porous, Mater, 17, 675. ; Han (2009), damage generation in ECAPed oxygen free copper Alloys, Fatigue, 25, 483. ; Rzadkosz (2013), Researching the Influence of Chemical Composition and Technological Parameters on the Quality of Copper Alloys Arch Foundry, Eng, 29, 153. ; Chung (null), Flash light sintered copper precursor / nanoparticle pattern with high electrical conductivity and low porosity for printed electronics Solid, Thin Films, 2015.