Title

Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules

Journal title

Archives of Metallurgy and Materials

Yearbook

2017

Volume

vol. 62

Issue

No 2

Authors

Kim, S.S. ; Son, I. ; Kim, K.T.

Divisions of PAS

Nauki Techniczne

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Date

2017

Identifier

DOI: 10.1515/amm-2017-0182 ; e-ISSN 2300-1909

Source

Archives of Metallurgy and Materials; 2017; vol. 62; No 2

References

Chen (2007), Scripta Mater, 56. ; Park (2015), Inst, 22, 254. ; Vasilevskiy (2006), th on, Proc Int Conf Austria, 25, 666. ; Kim (2013), Inst, 20, 345. ; Lin (2012), Electron Mater, 41, 153. ; Kim (2013), Carbon, 52. ; Disalro (1999), Science, 285. ; Wada (1990), Mater Sci Lett, 9. ; Chung (2000), Science, 287.