Title

Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles

Journal title

Archives of Metallurgy and Materials

Yearbook

2017

Volume

vol. 62

Issue

No 2

Authors

Jun Ho Hwang ; Lee, Jong-Hyun

Divisions of PAS

Nauki Techniczne

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Date

2017

Identifier

DOI: 10.1515/amm-2017-0167 ; e-ISSN 2300-1909

Source

Archives of Metallurgy and Materials; 2017; vol. 62; No 2

References

Gierlotka (2007), Mater Res, 22, 3158. ; Flandorfer (2007), Acta, 459. ; Bosco (2005), Acta Mater, 53, 2019. ; Lee (2005), Mater Trans, 46, 2413. ; Halonen (2013), IEEE Trans Compon Manuf Technol, 3, 350. ; Li (2011), Acta Mater, 59, 1198. ; Yin (2007), IEEE Trans Power Electron, 22, 392. ; Park (2012), Acta Mater, 60, 6278.