Details

Title

Measurement Capabilities Upgrade of GEM Soft X-ray Measurement System for Hot Plasma Diagnostics

Journal title

International Journal of Electronics and Telecommunications

Yearbook

2021

Volume

vol. 67

Issue

No 1

Affiliation

Linczuk, Paweł : Institute of Electronic Systems, Faculty of Electronics and Information Technology, University of Technology, Warsaw, Poland ; Wojenski, Andrzej : Institute of Electronic Systems, Faculty of Electronics and Information Technology, University of Technology, Warsaw, Poland ; Kolasinski, Piotr : Institute of Electronic Systems, Faculty of Electronics and Information Technology, University of Technology, Warsaw, Poland ; Krawczyk, Rafał : Institute of Electronic Systems, Faculty of Electronics and Information Technology, University of Technology, Warsaw, Poland ; Krawczyk, Rafał : CERN, Geneva, Switzerland ; Zabolotny, Wojciech : Institute of Electronic Systems, Faculty of Electronics and Information Technology, University of Technology, Warsaw, Poland ; Pozniak, Krzysztof : Institute of Electronic Systems, Faculty of Electronics and Information Technology, University of Technology, Warsaw, Poland ; Chernyshova, Maryna : Institute of Plasma Physics and Laser Microfusion, Warsaw, Poland ; Czarski, Tomasz : Institute of Plasma Physics and Laser Microfusion, Warsaw, Poland ; Gaska, Michał : Institute of Electronic Systems, Faculty of Electronics and Information Technology, University of Technology, Warsaw, Poland ; Kasprowicz, Grzegorz : Institute of Electronic Systems, Faculty of Electronics and Information Technology, University of Technology, Warsaw, Poland ; Malinowski, Karol : Institute of Plasma Physics and Laser Microfusion, Warsaw, Poland

Authors

Keywords

Measurement system ; GEM ; DAQ

Divisions of PAS

Nauki Techniczne

Coverage

115-120

Publisher

Polish Academy of Sciences Committee of Electronics and Telecommunications

Date

2021.02.17

Type

Article

Identifier

DOI: 10.24425/ijet.2021.135952

Source

International Journal of Electronics and Telecommunications; 2021; vol. 67; No 1; 115-120
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