Details
Title
Selective Cu Electrodeposition on Micrometer Trenches Using Microcontact Printing and AdditivesJournal title
Archives of Metallurgy and MaterialsYearbook
2021Volume
vol. 66Issue
No 3Authors
Affiliation
Shim, Jinyong : Hanyang University, Department of Material Science & Chemical Engineering, Ansan, Korea ; Lee, Jinhyun : Hanyang University, Department of Material Science & Chemical Engineering, Ansan, Korea ; Yoo, Bongyoung : Hanyang University, Department of Material Science & Chemical Engineering, Ansan, KoreaKeywords
µCP ; selective Cu deposition ; RDL ; overburden ; SAM (alkanethiol) ; AdditivesDivisions of PAS
Nauki TechniczneCoverage
741-744Publisher
Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of SciencesBibliography
[1] P.C. Andricacos, C. Uzoh, J.O. Dukovic, J. Horkans, H. Deligianni, Damascene copper electroplating for chip interconnections, IBM Journal of Research and Development 42 (1998) 567-574.[2] S.-Y. Chang, C.-W. Lin, H.-H. Hsu, J.-H. Fang, S.-J. Lin, Integrated Electrochemical Deposition of Copper Metallization for Ultralarge-Scale Integrated Circuits, Journal of The Electrochemical Society 151, C81 (2004).
[3] M.J. Kim, Y. Seo, H.C. Kim, Y. Lee, S. Choe, Y.G. Kim, S.K. Cho, J.J. Kim, Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums, Electrochimica Acta 163, 174-181 (2015).
[4] V .S. Rao, C.T. Chong, D. Ho, D.M. Zhi, C.S. Choong, L.P.S. Sharon, D. Ismael, Y.Y. Liang, Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications, in: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1522-1529 (2016).
[5] F.I. Lizama-Tzec, L. Canché-Canul, G. Oskam, Electrodeposition of copper into trenches from a citrate plating bath, Electrochimica Acta, 56, 9391-9396 (2011).
[6] T.P. Moffat, J.E. Bonevich, W.H. Huber, A. Stanishevsky, D.R. Kelly, G.R. Stafford, D. Josell, Superconformal Electrodeposition of Copper in 500–90 nm Features, Journal of The Electrochemical Society 147, 4524 (2000).
[7] F.Q. Liu, T. Du, A. Duboust, S. Tsai, W.-Y. Hsu, Cu Planarization in Electrochemical Mechanical Planarization, Journal of The Electrochemical Society 153, C377 (2006).
[8] S. Deshpande, S.C. Kuiry, M. Klimov, Y. Obeng, S. Seal, Chemical Mechanical Planarization of Copper: Role of Oxidants and Inhibitors, Journal of The Electrochemical Society 151, G788 (2004).
[9] F.B. Kaufman, D.B. Thompson, R.E. Broadie, M.A. Jaso, W.L. Guthrie, D.J. Pearson, M.B. Small, Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects, Journal of The Electrochemical Society 13, 3460- 3465 (1991).
[10] N.B. Larsen, H. Biebuyck, E. Delamarche, B. Michel, Order in Microcontact Printed Self-Assembled Monolayers, Journal of the American Chemical Society 119, 3017-3026 (1997).
[11] S.H. Lee, W.-Y. Rho, S.J. Park, J. Kim, O.S. Kwon, B.-H. Jun, Multifunctional self-assembled monolayers via microcontact printing and degas-driven flow guided patterning, Scientific Reports 8, 16763 (2018).
[12] T.E. Balmer, H. Schmid, R. Stutz, E. Delamarche, B. Michel, N.D. Spencer, H. Wolf, Diffusion of alkanethiols in PDMS and its implications on microcontact printing (μCP), Langmuir 21, 622-632 (2005).
[13] M. Hasegawa, Y. Negishi, T. Nakanishi, T. Osaka, Effects of additives on copper electrodeposition in submicrometer trenches, Journal of The Electrochemical Society 152, C221 (2005)
[14] M.H. Schoenfisch, J.E. Pemberton, Air Stability of Alkanethiol Self-Assembled Monolayers on Silver and Gold Surfaces, Journal of the American Chemical Society 120, 4502-4513 (1998).
[15] N.T. Flynn, T.N.T. Tran, M.J. Cima, R. Langer, Long-term stability of self-assembled monolayers in biological media, Langmuir 19, 10909-10915 (2003).