Title

Direct Energy Deposition of Mo Powder Prepared by Electrode Induction Melting Gas Atomization

Journal title

Archives of Metallurgy and Materials

Yearbook

2021

Volume

vol. 66

Issue

No 3

Affiliation

Roh, Goo-Won : University, Department of Materials Science and Engineering, Seoul 04763, Republic of Korea ; Roh, Goo-Won : Research and Development Center, Eloi Materials Lab (EML) Co. Ltd., Suwon 16229, Republic of Korea ; Park, Eun-Soo : Research and Development Center, Eloi Materials Lab (EML) Co. Ltd., Suwon 16229, Republic of Korea ; Moon, Jaeyun : University of Nevada, Department of Mechanical Engineering, Las Vegas, 4505 S. Maryland PKWY Las Vegas, NV 89154, United States ; Lee, Hojun : Seoul National University of Science and Technology, Department of Materials Science and Engineering Seoul 01811, Republic of Korea ; Byun, Jongmin : Seoul National University of Science and Technology, Department of Materials Science and Engineering Seoul 01811, Republic of Korea

Authors

Roh, Goo-Won ; Park, Eun-Soo ; Moon, Jaeyun ; Lee, Hojun ; Byun, Jongmin

Keywords

Molybdenum powder ; Electrode induction melting gas atomization ; Direct Energy Deposition ; Porosity ; Hardness

Divisions of PAS

Nauki Techniczne

Coverage

795-798

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Bibliography

[1] A. Mancaleoni, A. Sitta, Al. Colombo, R. Villa, G. Mirone, M. Renna, M. Calabretta, Copper wire bonding process characterization and simulation, 11th International Conference on Integrated Power Electronics Systems, Berlin, Germany, VDE Verlag GmbH (2020).
[2] G.H. Oh, S. Kim, T. Kim, J. Alloys Compd., (2020). DOI: https://doi.org/10.1016/j.jallcom.2020.157901 (in press).
[3] T.K. Chee, K.S. Theen, T.M. Sin, Cu-Cu wire bonding challenges on MOSFET wafer technology, 15th Electronics Packaging Technology Conference, Singapore, Singapore, VDE Verlag GmbH (2013).
[4] K . Mukai, T. Magaya, L. Brandt, Z. Liu, H. Fu, S. Hunegnaw, Adhesive enabling technology for directly plating copper onto glass, 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, IEEE (2014).
[5] B. He, J. Petzing, P. Webb, R. Leach, Opt. Lasers Eng. 75, 39-47 (2015).
[6] A.R.M. Yusoff, M.N. Syahrul, K. Henkel, Bull. Mater. Sci. 30, 329-331 (2007).
[7] L. Guo, W.Y. Zhang, Z.N. Xin, C.S. Yao, Int. J. Refract. Met. Hard Mater. 78, 45-50 (2019).
[8] X. Gao, L. Li, J. Liu, X. Wang, H. Yu, Int. J. Refract. Met. Hard Mater. 88, 105186 (2020).
[9] P. Alén, M. Ritala, K. Arstila, J. Keinonen, M. Leskelä, J. Electrochem. Soc. 152, G361 (2005).
[10] W. Li, X. Yan, A.G. Aberle, S. Venkataraj, Int. J. Photoenergy 2016, 1-10 (2016).
[11] P.S. Suryavanshi, C.J. Panchal, A.L. Patel, Mater. Today: Proc., (2020). DOI: https://doi.org/10.1016/j.matpr.2020.07.706 (in press).
[12] C. Wongwanitwatta1, M. Horprathum, C. Chananonnawathorn, AIP Conf. Proc. 2279, 120007 (2020).
[13] G. An, J. Sun, Y. Sun, W. Cao, Mater. Sci. Forum 913, 853-861 (2018).
[14] B. Bax, R. Rajput, R. Kellet, M. Reisacher, Addit. Manuf. 21, 487-494 (2018).
[15] D.R. Feenstra, A. Molotnikov, N. Birbilis, Mater. Des. 198, 109342 (2021).
[16] R. Ohser-Wiedemann, U. Martin, H. J. Seifert, A, Müller, Int. J. Refract. Met. Hard Mater. 28 (4), 550-557 (2010)

Date

2021.09.06

Type

Article

Identifier

DOI: 10.24425/amm.2021.136382

Source

Archives of Metallurgy and Materials