Title

Dissolution Behavior of Metal Impurities and Improvement of Reclaimed Semiconductor Wafer Cleaning by Addition of Chelating Agent

Journal title

Archives of Metallurgy and Materials

Yearbook

2021

Volume

vol. 66

Issue

No 4

Authors

Ryu, Keunhyuk ; Kim, Myungsuk ; Roh, Jaeseok ; Lee, Kun-Jae

Affiliation

Ryu, Keunhyuk : Dankook University, Department of Energy Engineering, Cheonan 31116, Republic of Korea ; Kim, Myungsuk : Dankook University, Department of Energy Engineering, Cheonan 31116, Republic of Korea ; Roh, Jaeseok : Dankook University, Department of Energy Engineering, Cheonan 31116, Republic of Korea ; Lee, Kun-Jae : Dankook University, Department of Energy Engineering, Cheonan 31116, Republic of Korea

Keywords

Reclaimed silicon wafer ; Wafer cleaning ; Metal impurity ; Metal complex ; Chelating agent

Divisions of PAS

Nauki Techniczne

Coverage

977-981

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Bibliography

[1] K. Liu, D. Zuo, X.P. Li, M. Rahman, J. Vac. Sci. Technol. B: Microelectronics and Nanometer Structures 27 (3), 1361-1366 (2009).
[2] M. Kim, K. Ryu, K.J. Lee, J. Korean Powder Metall. Inst. 28 (1), 25-30 (2021)
[3] W. Kern, J. Electrochem. Soc. 137 (6), 1887-1892 (1990).
[4] O .J. Anttila, J. Electrochem. Soc. 139 (4), 1180-1185 (1992).
[5] K. Saga, J. Electrochem. Soc. 143 (10), 3279-3284 (1996).
[6] M. Itano, F.W. Kern, M. Miyashita, T. Ohmi, IEEE Trans. Semicond. Manuf. 6 (3), 258-267 (1993).
[7] W. Kern, Handbook of silicon wafer cleaning technology, United States 2018.
[8] M. Matsuo, T. Takahashi, H. Habuka, A. Goto, Mat. Sci. Semicon. Proc. 110, 104970 (2020).
[9] G .W. Gale, D.L. Rath, E.I. Cooper, S. Estes, H.F. Okorn-Schmidt, J. Brigante, R. Jagannathan, G. Settembre, E. Adams, J. Electrochem. Soc. 148 (9), G513-G516 (2001).
[10] D. Liu, Z. Li, Y. Zhu, Z. Li, R. Kumar, Carbohydr. Polym. 111, 469-476 (2014).
[11] J.B. Fein, Geology 19 (10), 1037-1040 (1991).
[12] N. Zubair, K. Akhtar, Trans. Nonferrous Met. Soc. China 29 (1), 143-156 (2019).
[13] D. Nansheng, W. Feng, L. Fan, L. Zan, Chemosphere 35 (11), 2697-2706 (1997).
[14] A.K. Sharma, A. Singh, R.K. Mehta, S. Sharma, S.P. Bansal, K.S. Gupta, Int. J. Chem. Kinet. 43 (7), 379-392 (2011).
[15] M.Z. Mubarok, J. Lieberto, Procedia Earth Planet. Sci. 6, 457-464 (2013).
[16] D. Rai, B.M. Sass, D.A. Moore, Inorg. Chem. 26 (3), 345-349 (1987).
[17] C.H. Bamford, R.G. Compton, C.F.H. Tipper, Reactions of metallic salts and complexes, and organometallic compounds, Elsevier 1972.

Date

2021.12.28

Type

Article

Identifier

DOI: 10.24425/amm.2021.136409

Source

Archives of Metallurgy and Materials