Title

Heat dissipation and temperature distribution in long interconnect lines

Journal title

Bulletin of the Polish Academy of Sciences Technical Sciences

Yearbook

2010

Volume

58

Issue

No 1

Authors

Gnidzinska, K. ; De Mey, G. ; Napieralski, A.

Divisions of PAS

Nauki Techniczne

Coverage

119-124

Date

2010

Identifier

DOI: 10.2478/v10175-010-0012-8 ; ISSN 2300-1917

Source

Bulletin of the Polish Academy of Sciences: Technical Sciences; 2010; 58; No 1; 119-124

References

<i>International Technology Roadmap for Semiconductors</i> <a target="_blank" href='http://www.itrs.net/'>http://www.itrs.net/</a> ; Chatzigeorgiou A. (2001), Modeling CMOS gates driving RC interconnect loads, IEEE Trans. Circuits and Systems II: Analog and Digital Signal Processing, 48, 4, 413. ; Ismail Y. (1999), Dynamic and short-circuit power of CMOS gates driving lossless transmission lines, IEEE Trans. Circuits and Systems I: Analog and Digital Signal Processing, 46, 8, 950. ; <i>Predictive Technology Model (PTM)</i> <a target="_blank" href='http://ptm.asu.edu/'>http://ptm.asu.edu/</a> ; Vermeersch B. (2006), Thermal impedance plots of micro-scaled devices, Microelectronics and Reliability, 46, 1, 174. ; G. De Mey (2002), Various Applications of the Boundary Element Method. ; Çengel Y. (2002), Heat Transfer: a Practical Approach. ; Chiang T.-Y. (2002), Analytical thermal model for multilevel VLSI interconnects incorporating via effect, IEEE Electron Device Letters, 23, 1, 31.