Title

A Study on Electroless Copper Deposition for Desktop Stereolithography 3D Printing Materials

Journal title

Archives of Metallurgy and Materials

Yearbook

2024

Volume

vol. 69

Issue

No 4

Authors

Ahmad, A. ; Saidin Wahab, Md ; Kamarudin, K. ; Hehsan, H.

Affiliation

Ahmad, A. : Universiti Tun Hussein Onn Malaysia, Facult y of Engineering Technology, Department of Mechanical Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia ; Ahmad, A. : Universiti Tun Hussein Onn Malaysia, Innovative Manufacturing Technology (IMT), Facult y of Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia ; Saidin Wahab, Md : Universiti Tun Hussein Onn Malaysia, Adva nced Manufact uring and Mat erials Centre (AMMC), Parit Raja, 86400 Bat u Pahat , Johor, Malaysia ; Kamarudin, K. : Universiti Tun Hussein Onn Malaysia, Facult y of Engineering Technology, Department of Mechanical Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia ; Kamarudin, K. : Universiti Tun Hussein Onn Malaysia, Innovative Manufacturing Technology (IMT), Facult y of Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia ; Hehsan, H. : Universiti Tun Hussein Onn Malaysia, Facult y of Engineering Technology, Department of Mechanical Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia ; Hehsan, H. : Universiti Tun Hussein Onn Malaysia, Innovative Manufacturing Technology (IMT), Facult y of Engineering Technology, Pagoh Edu Hub, KM 1, Jalan Panchor, 84600 Pagoh, Johor, Malaysia

Keywords

Stereolithography ; Electroless copper deposition ; Optimization ; Adhesion quality

Divisions of PAS

Nauki Techniczne

Coverage

1419-1424

Publisher

Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences

Date

16.12.2024

Type

Article

Identifier

DOI: 10.24425/amm.2024.151409