Tytuł artykułu

Intermetallic compound layer formation in indium-based micro-bump array fabrication technology for IR detectors

Tytuł czasopisma

Opto-Electronics Review

Rocznik

2024

Wolumin

32

Numer

1

Afiliacje

Kozłowski, Paweł :  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Jasik, Agata :  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Łaszcz, Adam :  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Czuba, Krzysztof :  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Chmielewski, Krzysztof :  Łukasiewicz Research Network – Institute of Microelectronics and Photonics, Al. Lotników 32/46, 02-668 Warsaw, Poland ; Zdunek, Krzysztof : Warsaw University of Technology, Faculty of Materials Science and Engineering, ul. Wołoska 141, 02-507 Warsaw, Poland

Autorzy

Kozłowski, Paweł ; Jasik, Agata ; Łaszcz, Adam ; Czuba, Krzysztof ; Chmielewski, Krzysztof ; Zdunek, Krzysztof

Słowa kluczowe

indium micro-bump ; under bump metallization ; intermetallic alloy ; focused ion beam ; energy dispersive spectrometry

Wydział PAN

Nauki Techniczne

Zakres

e148833

Wydawca

Polish Academy of Sciences (under the auspices of the Committee on Electronics and Telecommunication) and Association of Polish Electrical Engineers in cooperation with Military University of Technology

Data

15.12.2023

Typ

Article

Identyfikator

DOI: 10.24425/opelre.2024.148833 ; ISSN 1896-3757